1/4 STPS2L40U ? january 2001 - ed: 1a low drop power schottky rectifier i f(av) 2a v rrm 40 v tj (max) 150 c v f (max) 0.34 v main product characteristics n very small conduction losses n negligible switching losses n low forward voltage drop n surface mount miniature package features and benefits single chip schottky rectifiers suited to switched mode power supplies and high frequency dc to dc converters. packaged in smb, this device is especially intended for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection applications. description smb (jedec do-214aa) symbol parameter value unit v rrm repetitive peak reverse voltage 40 v i f(rms) rms forward current 8 a i f(av) average forward current t l = 130c d = 0.5 2 a i fsm surge non repetitive forward current tp = 10 ms sinusoidal 75 a t stg storage temperature range - 65 to + 150 c tj maximum operating junction temperature * 150 c dv/dt critical rate of rise of reverse voltage 10000 v/ m s absolute ratings (limiting values) *: dptot dtj rth j a < - 1 () thermal runaway condition for a diode on its own heatsink
STPS2L40U 2/4 symbol parameter value unit r th (j-l) junction to lead smb 20 c/w thermal resistances symbol tests conditions tests conditions min. typ. max. unit i r * reverse leakage current tj = 25c v r =40v 220 m a tj = 100c 20 ma tj = 125c 38 80 ma v f * forward voltage drop tj = 25c i f = 1 a 0.39 v tj = 125c 0.25 0.28 tj = 25c i f = 2 a 0.43 tj = 125c 0.31 0.34 tj = 25c i f = 4 a 0.5 v tj = 125c 0.39 0.45 pulse tes t:*tp=380 m s, d <2% static electrical characteristics to evaluate the maximum conduction losses use the following equation : p=0.22xi f(av) + 0.06 i f 2 (rms) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 0.0 0.2 0.4 0.6 0.8 1.0 if(av) (a) pf(av)(w) t d =tp/t tp d = 0.05 d = 0.1 d = 0.2 d = 0.5 d = 1 fig. 1: average forward power dissipation versus average forward current. 0 25 50 75 100 125 150 0.0 0.4 0.8 1.2 1.6 2.0 2.4 tamb(c) if(av)(a) rth(j-a)=rth(j-l) rth(j-a)=100c/w t d =tp/t tp fig. 2: average forward current versus ambient temperature ( d =0.5). 1e-3 1e-2 1e-1 1e+0 0 2 4 6 8 10 12 t(s) im(a) ta=25c ta=100c ta=50c i m t d =0.5 fig. 3: non repetitive surge peak forward current versus overload duration (maximum values) 1e-2 1e-1 1e+0 1e+1 1e+2 1e+3 0.0 0.2 0.4 0.6 0.8 1.0 tp(s) zth(j-a)/rth(j-a) d = 0.5 d = 0.2 d = 0.1 single pulse t d =tp/t tp fig. 4: relative variation of thermal impedance junction to ambient versus pulse duration.
STPS2L40U 3/4 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 20 40 60 80 100 120 s(cu) (cm2) rth(j-a) (c/w) fig. 8: thermal resistance junction to ambient versus copper surface under each lead (epoxy printed circuit board fr4, copper thickness s(cu) = 35 m m) 0 50 100 150 200 250 300 350 400 450 500 0.0 0.5 1.0 1.5 2.0 2.5 3.0 vfm(mv) ifm(a) tj=25c tj=125c (typical values) tj=125c fig. 7-2: forward voltage drop versus forward current (maximum values, low level). 10.00 0 50 100 150 200 250 300 350 400 450 500 550 600 650 700 0.01 0.10 1.00 vfm(mv) ifm(a) tj=125c tj=125c (typical values) tj=25c fig. 7-1: forward voltage drop versus forward current (maximum values, high level). 0 5 10 15 20 25 30 35 40 1e-3 1e-2 1e-1 1e+0 1e+1 1e+2 vr(v) ir(ma) tj=125c tj=25c fig. 5: reverse leakage current versus reverse voltage applied (typical values). 1000 1 10 100 10 100 vr(v) c(pf) f=1mhz tj=25c fig. 6: junction capacitance versus reverse voltage applied (typical values).
STPS2L40U 4/4 package mechanical data smb e c l e1 d a1 a2 b ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.41 0.006 0.016 e 5.10 5.60 0.201 0.220 e1 4.05 4.60 0.159 0.181 d 3.30 3.95 0.130 0.156 l 0.75 1.60 0.030 0.063 1.52 2.75 2.3 1.52 foot print dimensions (in millimeters) information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap- proval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics ? 2001 stmicroelectronics - printed in italy - all rights reserved. stmicroelectronics group of companies australia - brazil - china - finland - france - germany - hong kong - india - italy - japan - malaysia malta - morocco - singapore - spain - sweden - switzerland - united kingdom - u.s.a. http://www.st.com ordering type marking package weight base qty delivery mode STPS2L40U gd4 smb 0.107g 2500 tape & reel n band indicates cathode n epoxy meets ul94,v0
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